Wafer Spin Dryer is a critical equipment in semiconductor manu-facturing, primarily used for drying wafers after wet cleaning pr-ocesses. This equipment integrates water spray cleaning, nitrog-en purging, and quartz infrared lamp drying functions, effective-ly removing contaminants and moisture from the wafer surface to ensure residue-free drying.It is compatible with 4-inch,6-inch, 8-inch,and 12-inch wafers,catering to various wafer sizes and m-eeting the high cleanliness and efficiency requirements of semic-onductor production lines.
Model | CGB-RD100 | CGB-RD150 | CGB-RD200 | CGB-RD300 |
Wafer Specifi cation | 4inch (with cassette) | 6inch (with cassette) | 8inch (with cassette) | 12inch (with cassette) |
Processing Time | ≤10min | |||
Rotation Speed | 0~50 RPM | |||
Processing Temperature | 60℃±2℃ | |||
Heater | Imported high purity quartz | |||
Temperature Management | Temperature sensor; platinum RTD | |||
Post-Processing Liquid Residue | No |