Horizontal Wafer Spin Dryer is a critical cleaning equipment in s-emiconductor manufacturing,specifically designed for efficient and rapid drying of wafers. This drying step is of utmost import-ance in ensuring the quality of subsequent processes and prod-uct reliability. Its core principle involves utilizing the centrifugal force generated by high-speed rotation to fling off moisture fro-m the wafer surface. During the spin-drying process, the rotatio-n creates an airflow within the chamber, drawing external air in through the tank cover. This air is then filtered and purified by t-he FFU(Fan Filter Unit)filter element before being smoothly exp-elled by a dedicated exhaust system. To address potential electr-ostatic buildup during spin-drying (which can easily lead to par-ticle adhesion), such airflow-type spin dryers typically incorpora-te electrostatic elimination components to effectively reduce su-ch occurrences.
Applicable Size | 4&6inch | 6&8inch | 12inch | |
Applicable Materials | Silicon、SIC、GaA、InP | |||
Maximum Rotational Speed | 800–1200 RPM | |||
Drying Time | 60–180 S/Batch | |||
Load Capacity | 4cassette/Batch ,25Pcs/cassette | |||
Chamber Material | 316L-EP Stainless Steel | |||
Filtration Grade | H14 HEPA (or ULPA U15) | |||
Ionizer Type | High-Frequency AC Ion Bar |